METHOD FOR DETACHING WAFERS FROM A WAFER CARRIER AND DEVICE FOR THIS PURPOSE

• Main Authors: WOLBER MICHAEL, WOLBER HANS-JORG, LAMPPRECHT JORG, WOLBER LECHEN, PLAUELN DIRK, WOLBER GERHARD
• Format: Patent
• Language: English
• Published: 01.09.2011
• Subjects: COMBINED OPERATIONS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

In a method for detaching wafers from a carrier unit, the wafers being formed by sawing a wafer block fastened to the carrier unit by gluing, and the wafers themselves still being glued on one side, the carrier unit with the wafers is introduced into an ungluing unit along a uniform movement plane. It remains therein and is enclosed in an ungluing basin by movable wall parts. Solvent for ungluing is applied into the ungluing basin and onto the wafers after the formation and closing of the ungluing basin to dissolve the glued bond and subsequently detach the wafers from the carrier unit.