Mix head assembly for forming chemical mechanical polishing pads

A mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers is provided, wherein inclusions of entrained gas inclusion defects are minimized.

Saved in:
Bibliographic Details
Main Authors LIBBERS PAUL, TRACY JONATHAN, VERBARO DAVID, GEIGER ANDREW M, ESBENSHADE JOHN, NOVEMBER SAMUEL J, SACCHETTI PAUL J, WATKINS MICHAEL E
Format Patent
LanguageEnglish
Published 04.08.2011
Subjects
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:A mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers is provided, wherein inclusions of entrained gas inclusion defects are minimized.
Bibliography:Application Number: US201113084159