PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE

• Main Authors: TAKEUCHI HITOSHI, FUNABIKI YOICHI
• Format: Patent
• Language: English
• Published: 28.07.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION OF NOISE BY SUCH CIRCUITS; GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

A package manufacturing method capable of manufacturing a package easily and efficiently. The package manufacturing method includes a jig disposing step of disposing a covering jig covering an outer peripheral portion on one surface of a first board so as to expose a hole forming region through a jig opening formed on the covering jig; and a filling step of filling a filling material constituting at least a part of penetration electrodes into holes. The filling step includes a metal mask disposing step of disposing a metal mask 84 on the covering jig so as to expose the hole forming region through the jig opening and a mask opening of the metal mask; and a main filling step of applying the filling material on the one surface of the first board so as to fill the filling material into the holes using a squeegee. The filling step is repeated in several rounds, and in the metal mask disposing step of a second or later round of the filling step, a metal mask of which the mask opening has a diameter larger than that used in a previous round of the metal mask disposing step is used.