SEMICONDUCTOR DEVICE

A semiconductor device includes an electrode pad formed above a semiconductor substrate, and being a connecting portion for an external electrical connection; a multilayer body including a plurality of first interconnect layers formed in a plurality of insulating films stacked between the semiconduc...

Full description

Saved in:
Bibliographic Details
Main Authors HIRANO HIROSHIGE, ITOU YUTAKA, OTA YUKITOSHI
Format Patent
LanguageEnglish
Published 21.07.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor device includes an electrode pad formed above a semiconductor substrate, and being a connecting portion for an external electrical connection; a multilayer body including a plurality of first interconnect layers formed in a plurality of insulating films stacked between the semiconductor substrate and the connecting portion and including an upper interconnect connected to the connecting portion, and a via configured to connect the first interconnect layers; a ring body formed in the plurality of insulating films to surround the multilayer body without interposing space, and including a plurality of second interconnect layers and at least one line via linearly connecting the second interconnect layers; and a lead line electrically connecting the connecting portion to an internal circuit. The multilayer body is connected to the ring body by at least one of the plurality of first interconnect layers. The lead line is connected to the ring body.
Bibliography:Application Number: US20100976618