METHOD FOR MODULAR ARRANGEMENT OF A SILICON BASED ARRAY AND MODULAR SILICON BASED ARRAY

A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second sili...

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Bibliographic Details
Main Authors PHILLIPS SCOTT J, DOLAN BRYAN R, MEYERS JOHN P, CELLURA MARK A, DINGMAN LYLE G, NYSTROM PETER J
Format Patent
LanguageEnglish
Published 21.07.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
Bibliography:Application Number: US20100689910