FLEXIBLE CIRCUITS

The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates...

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Bibliographic Details
Main Authors DHAU JASPREET SINGH, SHARMA SUNITY
Format Patent
LanguageEnglish
Published 21.07.2011
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Summary:The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Bibliography:Application Number: US201113078831