MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

• Main Authors: KIKUCHI SHUNICHI, SUGINO SHIGERU, NAKAMURA NAOKI, HATANAKA KIYOYUKI, KANAI RYO, TAKETOMI NOBUO
• Format: Patent
• Language: English
• Published: 09.06.2011
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A method for manufacturing a multilayer printed circuit board, and a printed circuit board manufactured according to the method, includes laterally-aligning a first inner substrate in which first insulation layers and first conductor layers are alternately laminated and a second inner substrate in which second insulation layers and second conductor layers are alternately laminated. The second inner substrate has a lager number of layers than the first inner substrate. The laterally-aligned first inner substrate and second inner substrate are placed between a pair of third insulation layers in a thickness direction. The pair of the third insulation layer are heated under pressure in the thickness direction. A conductor pattern is formed on surfaces of the pair of the third insulation layers.