METHOD FOR FORMING A SEED LAYER FOR THE DEPOSITION OF A METAL ON A SUBSTRATE

A method for forming, on a substrate, a seed layer enabling the subsequent deposition of a metal layer, including the step of immersing the substrate in a bath containing a material from the ethoxysilane or siloxane family and a copper or nickel amidinate.

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Bibliographic Details
Main Authors BARRIERE CLEMENT, MARGEAT OLIVER, FAU PIERRE, CHAUDRET BRUNO
Format Patent
LanguageEnglish
Published 19.05.2011
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Summary:A method for forming, on a substrate, a seed layer enabling the subsequent deposition of a metal layer, including the step of immersing the substrate in a bath containing a material from the ethoxysilane or siloxane family and a copper or nickel amidinate.
Bibliography:Application Number: US20090935186