METHOD FOR FORMING A SEED LAYER FOR THE DEPOSITION OF A METAL ON A SUBSTRATE
A method for forming, on a substrate, a seed layer enabling the subsequent deposition of a metal layer, including the step of immersing the substrate in a bath containing a material from the ethoxysilane or siloxane family and a copper or nickel amidinate.
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
19.05.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A method for forming, on a substrate, a seed layer enabling the subsequent deposition of a metal layer, including the step of immersing the substrate in a bath containing a material from the ethoxysilane or siloxane family and a copper or nickel amidinate. |
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Bibliography: | Application Number: US20090935186 |