LEADLESS SEMICONDUCTOR DEVICE TERMINAL

This document discusses, among other things, a semiconductor die having a first conductive bump coupled to a first electrical terminal at a first die surface of a semiconductor die and a dielectric substantially covering the first die surface and substantially surrounding the first conductive bump....

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Bibliographic Details
Main Authors GOMEZ JOCEL P, TANGPUZ CONSUELO N
Format Patent
LanguageEnglish
Published 28.04.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:This document discusses, among other things, a semiconductor die having a first conductive bump coupled to a first electrical terminal at a first die surface of a semiconductor die and a dielectric substantially covering the first die surface and substantially surrounding the first conductive bump. A surface of the dielectric can include a recessed terminal area, and a second electrical terminal can be coupled to the first conductive bump in the recessed terminal area.
Bibliography:Application Number: US20090607294