OPTO-ELECTRIC HYBRID MODULE AND METHOD OF MANUFACTURING THE SAME

An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide se...

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Bibliographic Details
Main Authors HODONO MASAYUKI, NISHIO HAJIME
Format Patent
LanguageEnglish
Published 17.03.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion (3a) is formed in a surface of an over cladding layer (3) of the optical waveguide section (W1). At least part of the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) for opto-electric conversion and at least part of a loop portion (8a) of a bonding wire (8) in the opto-electric conversion substrate section (E1) are positioned within the recessed portion (3a). This brings the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) and the reflecting surface (2a) formed in the core (2) closer to each other.
Bibliography:Application Number: US20100879755