LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes...

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Main Authors HAHM HUN JOO, SONG CHANG HO, PARK YOUNG SAM, HAN SEONG YEON, AHN HO SIK, NA YOON SUNG, HAN KYUNG TAEG, KIM DAE YEON, YEO IN TAE
Format Patent
LanguageEnglish
Published 10.02.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
Bibliography:Application Number: US20100907348