Semiconductor integrated circuit device

Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and...

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Bibliographic Details
Main Authors ASARI SANAE, NISHIMOTO KENJI, NAKAZATO SHINJI, KOHARA YUTAKA, SHINOZAKI MASAO, AKIOKA TAKASHI, MIYATA SHUSAKU
Format Patent
LanguageEnglish
Published 09.12.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
Bibliography:Application Number: US20100805261