CMUT Packaging for Ultrasound System

Ultrasonic scanners and methods of manufacturing ultra-sonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flex...

Full description

Saved in:
Bibliographic Details
Main Author HUANG YONGLI
Format Patent
LanguageEnglish
Published 04.11.2010
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Ultrasonic scanners and methods of manufacturing ultra-sonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flexible member can form a flexible subassembly which is rolled up to form an ultrasonic scanner. The integration of the IC and the transducer can occur at the same time. In the alternative, the integration of the electronic device can occur before the integration of the transducer. Moreover, the integration of the transducer can include using a semiconductor technique. Furthermore, the rolled up subassembly can form a lumen or can be attached to a lumen. The method can include folding a portion of the flexible subassembly to form a forward looking transducer. The flexible member of some subassemblies can include a pair of arms.
Bibliography:Application Number: US20080745754