RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME

Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of...

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Bibliographic Details
Main Authors LIM SUNG TAEK, LEE HWA YOUNG, OH JUN ROK, CHO JAE CHOON, PARK MOON SOO
Format Patent
LanguageEnglish
Published 28.10.2010
Subjects
BUILDING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CEILINGS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
ROOFS
WALLS, e.g. PARTITIONS
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Summary:Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided.
Bibliography:Application Number: US20090501919