METHOD FOR ISOLATING FLEXIBLE SUBSTRATE FROM SUPPORT SUBSTRATE

• Main Authors: CHANG YU-YANG, CHEN JANGLIN, JIANG LIANG-YOU, CHEN DONG-SEN
• Format: Patent
• Language: English
• Published: 21.10.2010
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING

A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.