Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad
A method for fabricating a semiconductor package substrate, including: preparing a copper clad laminate and half etching a copper foil on a wire bonding pad side of the copper clad laminate; depositing a first etching resist on the opposite sides of the copper clad laminate; forming circuit patterns...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
14.10.2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A method for fabricating a semiconductor package substrate, including: preparing a copper clad laminate and half etching a copper foil on a wire bonding pad side of the copper clad laminate; depositing a first etching resist on the opposite sides of the copper clad laminate; forming circuit patterns on the first etching resist, constructing circuits including a wire bonding pad and a ball pad after the model of the circuit patterns, and removing the first etching resist; applying a solder resist to the copper clad laminate in such a way to expose the wire bonding pad and the ball pad; and plating the wire bonding pad with gold and subjecting the ball pad to surface treatment. |
---|---|
Bibliography: | Application Number: US20100801723 |