INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF

A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an internal-interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate with the integral-interp...

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Bibliographic Details
Main Authors PARK YEONGIM, MYUNG JUNWOO, CHI HEEJO, CHUNG JAE HAN, LEE HYUNGMIN
Format Patent
LanguageEnglish
Published 30.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an internal-interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate with the integral-interposer-structure connected to the internal-interconnect; mounting an integrated circuit to the substrate and under the integral-interposer-structure; and encapsulating the internal-interconnect and the integrated circuit with an encapsulation.
Bibliography:Application Number: US20090410945