Molding Apparatus and Related Methods

The invention relates to molding systems and related methods. In one aspect of the invention, a molding apparatus includes a first cylindrical roll that is rotatably coupled to a frame and an adjacent pressure device, the frame is configured so that a substrate can pass through a nip formed between...

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Bibliographic Details
Main Authors TACHAUER ERNESTO S, BANKER SHAWN C, CLUNE WILLIAM P
Format Patent
LanguageEnglish
Published 23.09.2010
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
HABERDASHERY
HUMAN NECESSITIES
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES
JEWELLERY
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:The invention relates to molding systems and related methods. In one aspect of the invention, a molding apparatus includes a first cylindrical roll that is rotatably coupled to a frame and an adjacent pressure device, the frame is configured so that a substrate can pass through a nip formed between the first cylindrical roll and the pressure device while a portion of the substrate extends laterally beyond at least the frame and the first cylindrical roll.
Bibliography:Application Number: US20100777750