Method for Arranging a Powder Layer on a Substrate and Layer Structure with at least One Powder Layer on a Substrate
A process for arranging a powder layer comprising a powder on a substrate surface of a substrate. A substrate having a substrate surface is provided, and a mixture comprising the powder and an adhesion promoter is applied on the substrate surface. The adhesion promoter is removed and the powder laye...
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Main Author | |
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Format | Patent |
Language | English |
Published |
09.09.2010
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Subjects | |
Online Access | Get full text |
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Summary: | A process for arranging a powder layer comprising a powder on a substrate surface of a substrate. A substrate having a substrate surface is provided, and a mixture comprising the powder and an adhesion promoter is applied on the substrate surface. The adhesion promoter is removed and the powder layer is fixed on the substrate surface. |
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Bibliography: | Application Number: US20070303928 |