Method for Arranging a Powder Layer on a Substrate and Layer Structure with at least One Powder Layer on a Substrate

A process for arranging a powder layer comprising a powder on a substrate surface of a substrate. A substrate having a substrate surface is provided, and a mixture comprising the powder and an adhesion promoter is applied on the substrate surface. The adhesion promoter is removed and the powder laye...

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Bibliographic Details
Main Author LIEPOLD UTE
Format Patent
LanguageEnglish
Published 09.09.2010
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Summary:A process for arranging a powder layer comprising a powder on a substrate surface of a substrate. A substrate having a substrate surface is provided, and a mixture comprising the powder and an adhesion promoter is applied on the substrate surface. The adhesion promoter is removed and the powder layer is fixed on the substrate surface.
Bibliography:Application Number: US20070303928