Stacked package-on-package semiconductor device and methods of fabricating thereof

Methods for fabricating a semiconductor package are provided, by coupling a plurality of first interconnects and a semiconductor die to a first surface of a substrate, and depositing a mold material on the first surface by compression molding to fully encapsulate the die and to partially encapsulate...

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Bibliographic Details
Main Authors RUDGE A. VETHANAYAGAM, LIM BOK SIM
Format Patent
LanguageEnglish
Published 13.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods for fabricating a semiconductor package are provided, by coupling a plurality of first interconnects and a semiconductor die to a first surface of a substrate, and depositing a mold material on the first surface by compression molding to fully encapsulate the die and to partially encapsulate the first interconnects.
Bibliography:Application Number: US20080291292