SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semi...

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Main Authors JANG HYUNG-SUN, LEE YONGJIN, KANG UN-BYOUNG, KIM KEESEOK, JEON JONGKEUN, KWON WOONSEONG, KIM JUNG-HWAN, YI DONG-HUN
Format Patent
LanguageEnglish
Published 13.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.
AbstractList Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.
Author JANG HYUNG-SUN
LEE YONGJIN
KIM KEESEOK
KANG UN-BYOUNG
KWON WOONSEONG
JEON JONGKEUN
KIM JUNG-HWAN
YI DONG-HUN
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– fullname: KANG UN-BYOUNG
– fullname: KIM KEESEOK
– fullname: JEON JONGKEUN
– fullname: KWON WOONSEONG
– fullname: KIM JUNG-HWAN
– fullname: YI DONG-HUN
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Snippet Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate,...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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