SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semi...

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Main Authors JANG HYUNG-SUN, LEE YONGJIN, KANG UN-BYOUNG, KIM KEESEOK, JEON JONGKEUN, KWON WOONSEONG, KIM JUNG-HWAN, YI DONG-HUN
Format Patent
LanguageEnglish
Published 13.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.
Bibliography:Application Number: US20090617910