HEAT DISSIPATING STRUCTURE BASE BOARD, MODULE USING HEAT DISSIPATING STRUCTURE BASE BOARD, AND METHOD FOR MANUFACTURING HEAT DISSIPATING STRUCTURE BASE BOARD

• Main Authors: NAKASHIMA KOJI, OHNISHI TOHRU, KOUNO HITOSHI, IMANISHI TSUNETSUGU, NAKAO KEIICHI, TANIGUCHI TOSHIYUKI, NAKATA TOSHIYUKI
• Format: Patent
• Language: English
• Published: 15.04.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; PERFORMING OPERATIONS; PRINTED CIRCUITS; PUNCHING METAL; TRANSPORTING; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL

The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.