HEAT DISSIPATING DEVICE FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS

• Main Authors: HAGINO NORIYUKI, FUJIBAYASHI HIROKO, FUJIWARA DAIKI, MEGURO HIROYUKI
• Format: Patent
• Language: English
• Published: 15.04.2010
• Subjects: ACCESSORIES THEREFOR; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PHOTOGRAPHY; PHYSICS; PRINTED CIRCUITS

A heat dissipating device for an electronic apparatus includes an enclosure that houses a component of the electronic apparatus which becomes hot when the electronic apparatus is in use, the enclosure being made of a heat conductive material capable of dissipating heat in the enclosure to the outside, a heat receiving member provided between the component and the enclosure and capable of receiving heat from the component and transferring the received heat, a heat insulating member provided in contact with a side of the heat receiving member opposite from the component and configured to prevent transmission of the heat received by the heat receiving member, and a heat diffusing member provided between the heat insulating member and the enclosure in contact with both the heat insulating member and the enclosure and capable of receiving heat from the heat insulating member and diffusing the received heat into the enclosure.