MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE
The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cav...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
18.02.2010
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cavity (94, 96, 98). The invention is used in miniature microwave packages. |
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| AbstractList | The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cavity (94, 96, 98). The invention is used in miniature microwave packages. |
| Author | BESSEMOULIN ALEXANDRE |
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| Notes | Application Number: US20050722329 |
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| PublicationDecade | 2010 |
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| RelatedCompanies | UNITED MONOLITHIC SEMICONDUCTORS S.A.S |
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| Snippet | The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72)... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE |
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