MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cav...

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Bibliographic Details
Main Author BESSEMOULIN ALEXANDRE
Format Patent
LanguageEnglish
Published 18.02.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cavity (94, 96, 98). The invention is used in miniature microwave packages.
Bibliography:Application Number: US20050722329