PRIMER COMPOSITION AND ADHESIVE SUBSTRATE

To provide a primer for imparting high adhesive property and high heat resistance to the surface of a substrate. The primer composition is constructed to comprise (1) a maleic acid-modified polyolefin, (2) an organic diamine having a number average molecular weight of at least 150, and (3) a solvent...

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Bibliographic Details
Main Author ISHIDA NEYOSHI
Format Patent
LanguageEnglish
Published 11.02.2010
Subjects
ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
TRANSPORTING
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:To provide a primer for imparting high adhesive property and high heat resistance to the surface of a substrate. The primer composition is constructed to comprise (1) a maleic acid-modified polyolefin, (2) an organic diamine having a number average molecular weight of at least 150, and (3) a solvent.
Bibliography:Application Number: US20080523338