METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS

A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of condu...

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Bibliographic Details
Main Authors KAWAKAMI SHIGEAKI, NEBASHI TORU
Format Patent
LanguageEnglish
Published 17.12.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of conductive balls in an area that is part of the surface of the mask, and moving the area so that parts of a path taken by the area overlap. By limiting the area where filling is carried out and moving the conductive balls while gathering the conductive balls in this area, it is possible to prevent losses for the conductive balls, to increase the filling efficiency, and to suppress the number of unfilled apertures.
Bibliography:Application Number: US20090484516