Multilayered Polymeric Structure

A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process...

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Bibliographic Details
Main Authors FRIEND STEPHEN O, BRYANT EDWARD W.S, FOWLER HAROLD C
Format Patent
LanguageEnglish
Published 19.11.2009
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Summary:A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components.
Bibliography:Application Number: US20070841626