Multilayered Polymeric Structure
A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
19.11.2009
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Subjects | |
Online Access | Get full text |
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Summary: | A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components. |
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Bibliography: | Application Number: US20070841626 |