COOLING DEVICE, HEAT SINK, AND ELECTRONIC APPARATUS

• Main Authors: ISHIKAWA HIROICHI, MAKINO TAKUYA, HORI KAZUHITO, TAKINO HIROSHI
• Format: Patent
• Language: English
• Published: 22.10.2009
• Subjects: BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PRINTED CIRCUITS; WEAPONS

There are provided a cooling device and a heat sink that can effectively radiate heat generated by a heat source while reducing the volume of discharged gas to avoid noise, and an electronic apparatus in which the cooling device and the heat sink are mounted. A heat sink 3 includes cutouts 24a and 24b through which air serving as gas can be taken in from the outside and which are provided on a side where air discharged from first and second nozzles 6 and 7 serving as openings of a jet generating mechanism 2 is received. Therefore, the pressure near the cutouts is decreased by air flow discharged from the first and second nozzles 6 and 7, and outside air is taken in through the cutouts 24a and 24b. Consequently, more gas than gas discharged from the first and second nozzles 6 and 7 is discharged from an outlet of the heat sink. This can minimize the volume of jetted gas to avoid noise, and effectively radiate heat generated by a heat source.