Techniques for Layer Transfer Processing
Techniques for the fabrication of semiconductor devices are provided. In one aspect, a layer transfer structure is provided. The layer transfer structure comprises a carrier substrate having a porous region with a tuned porosity in combination with an implanted species defining a separation plane th...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
17.09.2009
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Subjects | |
Online Access | Get full text |
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Summary: | Techniques for the fabrication of semiconductor devices are provided. In one aspect, a layer transfer structure is provided. The layer transfer structure comprises a carrier substrate having a porous region with a tuned porosity in combination with an implanted species defining a separation plane therein. In another aspect, a method of forming a layer transfer structure is provided. In yet another aspect, a method of forming a three dimensional integrated structure is provided. |
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Bibliography: | Application Number: US20090472943 |