Multi-chip package

A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed...

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Bibliographic Details
Main Authors EOM JOO-YANG, PARK MIN-HYO, CHOI SEUNG-YONG
Format Patent
LanguageEnglish
Published 09.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed by a chemical vapor deposition method between a lead frame or a heat sink and the semiconductor chips disposed thereon.
Bibliography:Application Number: US20080316367