Method for Enhancing the Adhesion of a Passivation Layer on a Semiconductor Device

In a method for making a semiconductor component, an integrated circuit is provided with a chip pad on an active side. A conductive track is connected to the chip pad and a passivation layer covers the conductive track. Forming the conductive track includes structuring an uneven sidewall for form cl...

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Bibliographic Details
Main Authors SCHEDEL THORSTEN, BERGHOF VOLKER
Format Patent
LanguageEnglish
Published 02.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In a method for making a semiconductor component, an integrated circuit is provided with a chip pad on an active side. A conductive track is connected to the chip pad and a passivation layer covers the conductive track. Forming the conductive track includes structuring an uneven sidewall for form closure with the passivation layer.
Bibliography:Application Number: US20070967165