Multi-Die Processor

Disclosed are a multi-die processor apparatus and system. Processor logic to execute one or more instructions is allocated among two or more face-to-faces stacked dice. The processor includes a conductive interface between the stacked dice to facilitate die-to-die communication.

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Bibliographic Details
Main Authors BLACK BRYAN P, WEBB M. CLAIR, SAMRA NICHOLAS G
Format Patent
LanguageEnglish
Published 28.05.2009
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:Disclosed are a multi-die processor apparatus and system. Processor logic to execute one or more instructions is allocated among two or more face-to-faces stacked dice. The processor includes a conductive interface between the stacked dice to facilitate die-to-die communication.
Bibliography:Application Number: US20090365171