Epoxy Formulations for Use in Lithography Techniques

• Main Authors: CHEN WEI, TONGE JAMES STEVEN, MAGHSOODI SINA, HARKNESS BRIAN ROBERT
• Format: Patent
• Language: English
• Published: 23.04.2009
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MATERIALS THEREFOR; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; METALLURGY; NANOTECHNOLOGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A method for preparing a patterned feature includes the steps of I) casting a curable silicone composition against a master, II) curing the curable silicone composition to form a silicone mold, II) separating the master and the silicone mold, IV) filling a silicone mold having a patterned surface with a curable epoxy formulation; V) curing the curable epoxy formulation to form a patterned feature; VI) separating the silicone mold and the patterned feature; optionally VIII) etching the patterned feature; optionally IX) cleaning the silicone mold; and optionally X) repeating steps IV) to IX) reusing the silicone mold.