ELECTROLESS DEPOSITION FROM NON-AQUEOUS SOLUTIONS
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
16.04.2009
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Subjects | |
Online Access | Get full text |
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Summary: | A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided. |
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Bibliography: | Application Number: US20080338998 |