ELECTRONIC DEVICES WITH HYBRID HIGH-K DIELECTRIC AND FABRICATION METHODS THEREOF

Electronic devices with hybrid high-k dielectric and fabrication methods thereof. The electronic device includes a substrate. A first electrode is disposed on the substrate. Hybrid high-k multi-layers comprising a first dielectric layer and a second dielectric layer are disposed on the substrate, wh...

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Bibliographic Details
Main Authors WANG JIUN-JIE, WEN JIING-FA, LEE WEN-HSI, LEE CHENGUNG, LIN WEI-LING, HU TARNG-SHIANG
Format Patent
LanguageEnglish
Published 02.04.2009
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Summary:Electronic devices with hybrid high-k dielectric and fabrication methods thereof. The electronic device includes a substrate. A first electrode is disposed on the substrate. Hybrid high-k multi-layers comprising a first dielectric layer and a second dielectric layer are disposed on the substrate, wherein the first dielectric layer and the second dielectric layer are solvable and substantially without interface therebetween. A second electrode is formed on the hybrid multi-layers.
Bibliography:Application Number: US20080332794