SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME

In a solid-state image pickup device, a thickness of an insulating film, a width and a thickness of wirings, a length of the wirings, or a diameter of bump portions formed on the wirings is formed so that a capacitance of a capacitor structure generated between a solid-state image sensor chip, and t...

Full description

Saved in:
Bibliographic Details
Main Author TSUJIMURA KOUJI
Format Patent
LanguageEnglish
Published 12.03.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:In a solid-state image pickup device, a thickness of an insulating film, a width and a thickness of wirings, a length of the wirings, or a diameter of bump portions formed on the wirings is formed so that a capacitance of a capacitor structure generated between a solid-state image sensor chip, and the wirings and the bump portions is not more than a desired value. Thereby, sensitivity of the solid-state image pickup device is not lowered at high-frequency driving.
Bibliography:Application Number: US20080204537