METHODS FOR DESIGNING SECONDARY CUTTING STRUCTURES FOR A BOTTOM HOLE ASSEMBLY

A method for designing a secondary cutting structure for use in a bottom hole assembly, the method including defining initial design parameters for the secondary cutting structure and analyzing forces acting on the secondary cutting structure. Additionally, the method includes modifying at least one...

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Bibliographic Details
Main Authors WHIPPLE GORDON, HUANG SUJIAN J, TANG WEI, NELSON GAIL, LAIRD TOMMY, MAKKAR NAVISH
Format Patent
LanguageEnglish
Published 26.02.2009
Subjects
ANALOGUE COMPUTERS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:A method for designing a secondary cutting structure for use in a bottom hole assembly, the method including defining initial design parameters for the secondary cutting structure and analyzing forces acting on the secondary cutting structure. Additionally, the method includes modifying at least one design element of the secondary cutting structure and simulating an effect of the modifying on both the secondary cutting structure and a primary cutting structure to determine if an improved condition is met. Also, a method for designing a drilling tool assembly, the method including defining initial drilling tool assembly design parameters including a primary cutting structure and a secondary cutting structure, and simulating a dynamic response of the drilling tool assembly. Additionally, the method includes adjusting at least one design element of the secondary cutting structure based on the dynamic response of the drilling tool assembly, determining if the adjusted design element improved a condition of the drilling, and repeating the simulating and adjusting until the condition is optimized.
Bibliography:Application Number: US20080179516