CURABLE ENCAPSULANT COMPOSITION AND ASSOCIATED METHOD
An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one react...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
15.01.2009
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Subjects | |
Online Access | Get full text |
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Summary: | An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. |
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Bibliography: | Application Number: US20070877320 |