SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

A semiconductor integrated circuit device includes a die pad and a semiconductor chip mounted over the die pad, having a main surface with surface electrodes and a back surface. Suspension leads support the die pad, and leads are arranged around the semiconductor chip, each of the leads having inner...

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Bibliographic Details
Main Authors KANEDA TSUYOSHI, SUZUKI HIROMICHI, MIYAKI YOSHINORI
Format Patent
LanguageEnglish
Published 15.01.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor integrated circuit device includes a die pad and a semiconductor chip mounted over the die pad, having a main surface with surface electrodes and a back surface. Suspension leads support the die pad, and leads are arranged around the semiconductor chip, each of the leads having inner and outer lead portions. A first plating layer is formed at a part of the inner lead portions and a second plating layer is formed over the outer lead portion. Wires electrically connect the surface electrodes with the inner lead portions through the first plating layer. A resin body seals the die pad, the chip, the wires and the inner lead portions. The second plating layer is comprised of different materials than the first plating layer, and is a Pb-free metal layer.
Bibliography:Application Number: US20080133210