INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION

An integrated circuit package system comprising: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection s...

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Bibliographic Details
Main Authors SONG SUNGMIN, AHN SEUNGYUN, BAE JOHYUN
Format Patent
LanguageEnglish
Published 01.01.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit package system comprising: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure.
Bibliography:Application Number: US20070768640