Au-Sn Alloy Bump Having no Trapped-In Large Void and Process for Producing the Same

An Au-Sn alloy bump that does not include large voids and a method of producing the same are provided. The An Au-Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 a...

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Bibliographic Details
Main Authors MISHIMA AKIFUMI, KOHINATA MASAYOSHI, ISHIKAWA MASAYUKI
Format Patent
LanguageEnglish
Published 11.12.2008
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:An Au-Sn alloy bump that does not include large voids and a method of producing the same are provided. The An Au-Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.
Bibliography:Application Number: US20080094167