METHOD AND APPARATUS FOR DEBONDING OF STRUCTURES WHICH ARE BONDED TOGETHER, INCLUDING (BUT NOT LIMITED TO) DEBONDING OF SEMICONDUCTOR WAFERS FROM CARRIERS WHEN THE BONDING IS EFFECTED BY DOUBLE-SIDED ADHESIVE TAPE

• Main Authors: BERGER MICHAEL A, BERGER ALEXANDER J
• Format: Patent
• Language: English
• Published: 11.12.2008
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

When heat or UV radiation is applied to an adhesive tape (130) which bonds a semiconductor wafer (110) to a carrier (120), the appropriate lift-off time for separating the wafer from the carrier is determined by monitoring the thickness (T or DeltaT) of the wafer/tape/carrier sandwich. When the thickness or the thickness change has reached a predefined value or range of values, independently moveable driving members (510R) drive the wafer or the carrier with small forces at a plurality of spaced-apart locations along the periphery. As a result, the lift-off is initiated at the location of the weakest adhesion.