Electronic Device Package Manufacturing Method and Electronic Device Package

By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space located in between the base member and the lid member. Then, by performing etching from a surface of the lid...

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Bibliographic Details
Main Authors HIGASHI KAZUSHI, MAEGAWA YUKIHIRO
Format Patent
LanguageEnglish
Published 13.11.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space located in between the base member and the lid member. Then, by performing etching from a surface of the lid member on the side opposite from the base member by a prescribed method, through holes that reach the surface of the internal electrodes are formed. A conductive material is given to the through holes, and external electrodes connected to the internal electrodes are formed in a plane, completing a thin type electronic device package.
Bibliography:Application Number: US20060883166