Semiconductor memory device including post package repair control circuit and post package repair method

Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit...

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Bibliographic Details
Main Authors SEO SEUNG-WHAN, LIM HYUN-TAE, RYU SANG-JOON, JANG HYUN-SOON, KANG JAE-SUNG, KWAK BYUNG-HEON
Format Patent
LanguageEnglish
Published 09.10.2008
Subjects
INFORMATION STORAGE
PHYSICS
STATIC STORES
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Summary:Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.
Bibliography:Application Number: US20080080728