WAFER CENTER FINDING WITH CHARGE-COUPLED DEVICES

A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.

Saved in:
Bibliographic Details
Main Author FOGEL PAUL E
Format Patent
LanguageEnglish
Published 25.09.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
Bibliography:Application Number: US20080032489