SEMICONDUCTOR-CHIP EXFOLIATING DEVICE AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD

• Main Authors: SHIBATA MOTOJIRO, USHIJIMA AKIRA
• Format: Patent
• Language: English
• Published: 18.09.2008
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31 a , 31 b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30 b in a direction to depart from the other needle pin 30 a. By the sliding unit 33 , the interval between the needle pins 30 a , 30 b can be changed so as to cope with a variation of semiconductor chips 1, 1 A.