Housing System for Electronic Devices
A housing system for electronic devices, especially for the automobile sector has a top part and a bottom part. A pressure compensation film is fixed to the bottom part of the housing as a top part of the housing. Advantageously, the housing system is flexible, can be individually and thus variably...
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Main Author | |
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Format | Patent |
Language | English |
Published |
04.09.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A housing system for electronic devices, especially for the automobile sector has a top part and a bottom part. A pressure compensation film is fixed to the bottom part of the housing as a top part of the housing. Advantageously, the housing system is flexible, can be individually and thus variably adjusted to the space required, and encompasses a sealing system that is integrated in a pressure compensation element. The housing is suitable particularly for applications in the automobile sector. |
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Bibliography: | Application Number: US20060064101 |